We have successfully fabricated a 3D super-capacitor, which can be integrated with MEMS in a wafer level, using Si trenches (aspect ratio = 53) and ultra-conformal supercritical fluid deposition (SCFD) of Cu/SiO2 layers. Taking advantage of large inner surface area of the trenches, the 3D capacitor exhibited 70 times larger capacitance than a planar one having the same projected area, and low leakage current density (<;3.8×10-5 A/cm2) at an electric field of 1.5-2.4 MV/cm. This achievement is brought about by ultra-conformal and void-free coating of a SiO2 layer, having a dielectric constant equivalent to the film by conventional deposition method, and ultra-conformal deposition of Cu on oxide surface, both of which are significant achievements for SCFD. Metal-insulator-metal structure is also feasible using a similar process technology, which will allow us monolithic integration of a power storage element, a power generator and sensors in a single MEMS chip for the purpose of battery-free sensor nodes in sensor network.
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机译:我们已经成功地制造了一种3D超级电容器,其可以使用Cu / SiO 2的超导超临界流体沉积(SCFD)和Ult-Conformal intical沉积(SCFD)在晶片级中与MEMS集成。子>层。利用沟槽的大型内表面区域,3D电容器的电容比具有相同投影面积的平面呈现70倍,低漏电流密度(<; 3.8×10 -5 sup> a / cm 2 sup>),电场为1.5-2.4 mV / cm。通过常规沉积方法,通过常规沉积方法具有相当于薄膜的介电常数,并在氧化物表面上具有相当于薄膜的介电常数和无空隙涂层的这种成就。 ,这两者都是SCFD的重要成就。金属绝缘体 - 金属结构也是可行的,使用类似的工艺技术也是可行的,这将使您在单个MEMS芯片中的电力存储元件,发电机和传感器的单片集成,以便在传感器网络中无电池传感器节点。
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