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Self-assembled nanoparticle arrays as nanomasks for pattern transfer

机译:自组装纳米粒子阵列作为用于图案转移的纳米术

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Argon ion milling was used to transfer the pattern of sparse 12 nm iron oxide nanoparticles into underlying thin films of Pt and magnetic tunnel junction stacks and quantify their etching rates and morphological evolution. Under typical milling conditions, Pt milled at 10 nm min~(-1), while the isolated particles of iron oxide used for the mask milled at 5 nm min~(-1). Dilute dispersions of nanoparticles were used to produce the sparse nanomasks, and high resolution scanning electron microscopy (SEM) and atomic force microscopy were used to monitor the evolution of etched structures as a function of milling time. SEM measurements indicate an apparent 20percent increase in feature diameter before the features began to diminish under additional milling, suggesting redeposition as a limiting feature in the milling of dense arrays. Simulations of the milling process in nanoparticle arrays that include redeposition are consistent with this observation. These simulations predict that an edge-to-edge spacing of 3 nm in a dense array is feasible, but that redeposition reduces the final structure aspect ratio from that of the masking array by as much as a factor of two.
机译:氩离子铣削用于将稀疏12nm氧化铁纳米颗粒的图案转移到Pt和磁隧道结堆的下面的薄膜中,并量化它们的蚀刻速率和形态进化。在典型的铣削条件下,Pt在10nm min〜(-1)下研磨,而用于在5nm min〜(-1)的掩模中用于掩模的隔离颗粒。使用纳米颗粒的稀释分散体来产生稀疏的纳米瘤,并且使用高分辨率扫描电子显微镜(SEM)和原子力显微镜,以监测蚀刻结构的演变作为研磨时间的函数。 SEM测量表明,在额外铣削下,特征开始在特征开始之前的特征直径的表观20%增加,建议将重新沉积作为密集阵列的铣削中的限制特征。纳米粒子阵列中的铣削过程的模拟包括雷沉积与该观察一致。这些仿真预测了致密阵列中3nm的边缘到边缘间隔是可行的,但是重新沉降将最终结构纵横比从掩蔽阵列的最终结构纵横比降低多达两倍。

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