The Research of Zero Shrinkage LTCC Tape for Integral Substrate / Package

摘要

To meet the demand of multi-IC die assembly and multi-I/O terminal in MCM-C, This paper introduce the designing, manufacturing, and inspection of a kind of Integral Substrate/Package with PGA terminal which made from Heraeus zero shrinkage system by LTCC process. The large package formed by co-fired multi-layer substrate and metal ring, and it is a high sealed package that can do parallel-sealing.