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Thin film capacitors fabricated by chemical solution deposition

机译:由化学溶液沉积制造的薄膜电容器

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It was found that the dielectric properties of BaTiO3 films on Ni foil substrates varied with oxygen partial pressure and composition. 200 nm thick Mn doped BaTiO3 films annealed at 1000?°C in 10??12 atm pO2 showed a dielectric constant of 950 and low loss up to 250kV/cm bias electric field. Mn doping may trap electrons introduced by oxygen vacancies formed due to low oxygen partial pressures during heat-treatment. High dielectric constant values were achieved for 200nm thick films, so scaling of the dielectric to around 100nm should be possible. As the oxygen partial pressure during firing drops, the dielectric loss of Mn doped BaTiO3 film suddenly increased at low electric field. Carbon residue as well as oxygen partial pressure and composition can affect the dielectric properties. Removal of carbon residue was retarded from 750?°C in air to 1000?°C in nitrogen ambients. Also, residual carbon was found after 1000?°C annealing in reducing ambient by electron energy loss spectroscopy (TEM-EELS) analysis. This residual carbon led to local reductions in the oxygen partial pressure during firing, reduced titanium ions, and to the presence of a Ni-Ba interfacial alloy layer on the surface of the Ni foils.
机译:发现Ni箔底物上的BATIO3膜的介电性能随氧分压和组成而变化。在10μl10Ω℃下退火的200nm厚的Mn掺杂的BatiO3薄膜在10 ?? 12 ATM PO2中显示出950的介电常数和高达250kV / cm偏置电场的低损耗。 Mn掺杂可以通过在热处理期间由于低氧局部压力而形成的氧空位引入的捕获电子。实现了高介电常数值对于200nm厚的薄膜,因此应该可以进行介电至约100nm的缩放。随着烧制过程中的氧分压,Mn掺杂BATIO3膜的介电损失在低电场下突然增加。碳残留物以及氧分压和组合物可以影响电介质性质。将碳残余物除去在空气中以750℃延迟至1000℃的氮气。此外,在通过电子能损光谱(TEM-EEL)分析中减少环境后,在1000℃退火后发现残留碳。该残留的碳导致烧制,减少钛离子的氧分压局部减少,并在Ni箔表面上存在Ni-Ba界面合金层的存在。

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