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Set Power Dependency on the Resistive Switching in Cr-doped SrZrO{sub}3 Thin Films for Nonvolatile Memory Devices

机译:设置功率依赖性关于CR掺杂Srzro {Sub} 3薄膜的电阻切换,用于非易失性存储器件

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Pt/Cr-doped SrZrO{sub}3/SrRuO{sub}3 metal-oxide-metal (MOM) structures were fabricated by off-axis rf sputtering for nonvolatile memory applications. The MOM structures showed reproducible and bistable resistive switching behaviors. From the low-temperature I-V measurements, it was found that the low-resistance state (LRS) was governed by ohmic conduction. In addition, the characteristics of LRS were influenced by switching parameters. With increasing set power and sweep delay time, the LRS current was decreased. These results suggested that the resistive switching mechanism is related to the formation of local conducting path in SrZrO{sub}3 matrix.
机译:Pt / Cr掺杂的srzro {sub} 3 / srruo {sub} 3金属氧化物 - 金属(MOM)结构是通过用于非易失性存储器应用的轴轴射流制造的。 MOM结构显示可重复和可重复的电阻切换行为。从低温I-V测量中,发现低电阻状态(LRS)受欧姆传导的控制。此外,LRS的特性受切换参数的影响。随着设定功率和扫描延迟时间的增加,LRS电流减少了。这些结果表明,电阻切换机构与Srzro {Sub} 3矩阵中的局部导电路径的形成有关。

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