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RTP DIFFUSION AND JUNCTION FORMATION IN Si AND GaAs

机译:Si和GaAs中的RTP扩散和结形成

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The investigation results of the RTP enhanced diffusion of P in Si and Zn in GaAs, the mechanism, models and the role of quantum effects are presented in this paper. Shallow and ultra-shallow p{sup}+-n, n{sup}+-p junctions have been obtained and analyzed. The experimental concentration profiles were simulated based on the dissociative diffusion mechanism. The diffusion coefficients and activation energies of the RTP enhanced diffusion and conventional furnace annealing were analyzed. The activation energy of RTP diffusion is lower than the conventional furnace diffusion and diffusion coefficient is higher by 1-3 order of magnitude. The p-n junctions with depth of 0.02 - 0.4μm have been obtained by RTP for 0.1 - 3min diffusion time.
机译:本文介绍了在GaAs中Si和Zn中P的RTP增强扩散的调查结果,机制,模型和量子效应的作用。已经获得并分析了浅和超浅p {sup} + - n,n {sup} + -p结。基于离灭扩散机制模拟实验浓度型材。分析了RTP增强扩散和传统炉退火的扩散系数和激活能量。 RTP扩散的激活能量低于传统的炉子扩散,扩散系数较高1-3个级。通过RTP获得了0.02-0.4μm的深度为0.1-3min扩散时间的P-N结。

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