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IMPACT OF AL, NI, AND TIN METAL GATES ON ZRO_2 -MOS CAPACITORS

机译:Al,Ni和锡金属门对ZrO_2-MOS电容器的影响

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We compare the impact of Aluminum, Nickel and Titanium-Nitride as gate materials on MOS capacitors incorporating metal organic chemical vapor deposited (MOCVD) Zr02. Post metallization annealing (PMA) in forming gas atmosphere on the electrical characteristics of the various gate stacks is a further issue. Aluminum was primarily investigated as a reference material. Whereas TiN-stacks show very promising electrical characteristics necessary for future CMOS devices, Ni-MOS capacitors exhibit an undesired high frequency behavior.
机译:我们将铝,镍和氮化物的影响与浇筑电容器上的栅极材料进行比较,包括金属有机化学气相沉积(MOCVD)ZrO 2。金属化退火(PMA)在形成气体气氛中的各种栅极堆叠的电气特性是另一个问题。铝主要被研究为参考材料。锡堆叠显示了未来CMOS器件所需的非常有希望的电气特性,Ni-MOS电容器表现出不希望的高频行为。

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