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首页> 外文期刊>Applied Physicsletters >In_(0.53)Ga_(0.47)As based metal oxide semiconductor capacitors with atomic layer deposition ZrO_2 gate oxide demonstrating low gate leakage current and equivalent oxide thickness less than 1 nm
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In_(0.53)Ga_(0.47)As based metal oxide semiconductor capacitors with atomic layer deposition ZrO_2 gate oxide demonstrating low gate leakage current and equivalent oxide thickness less than 1 nm

机译:具有原子层沉积ZrO_2栅氧化物的In_(0.53)Ga_(0.47)As基金属氧化物半导体电容器证明了低栅漏电流和等效氧化物厚度小于1 nm

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摘要

The paper demonstrates properties of metal oxide semiconductor capacitors fabricated on molecular beam epitaxial In_(0.53)Ga_(0.47)As wafers with the atomic layer deposition ZrO_2 gate oxide. The equivalent oxide thickness of 0.8 nm was obtained for 5 nm thick ZrO_2, while the gate leakage current density at V_(FB)+1 V was as low as 0.1 A/cm~2. Sensitivity of capacitance-voltage characteristics to the metal gate work function along with low frequency dispersion of ~5%/decade served as a strong evidence of a nonpinned Fermi level at the oxide-InGaAs interface. Both electrical and structural properties remain stable up to 800℃.
机译:本文证明了在分子束外延In_(0.53)Ga_(0.47)As晶片上制备的金属氧化物半导体电容器的性能,该晶片具有原子层沉积ZrO_2栅氧化物。对于5nm厚的ZrO_2,获得0.8nm的等效氧化物厚度,而在V_(FB)+ 1V下的栅极泄漏电流密度低至0.1A / cm〜2。电容-电压特性对金属栅极功函数的敏感度以及约5%/数十的低频色散证明了氧化物-InGaAs界面处的非费米能级。高达800℃的电性能和结构性能均保持稳定。

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