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ADVANCED HIGH K DIELECTRICS FOR NANO-ELECTRONICS —SCIENCE AND TECHNOLOGIES

机译:用于纳米电子-SCOIENCE和Technologies的先进高k电介质

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Some of our research activities on high κ gate dielectrics on GaAs (and its related compound semiconductors), Si, and GaN are reviewed. Ga_2O_3(Gd_2O_3), the novel oxide, which was electron-beam evaporated from a gallium-gadolinium-garnet target in UHV, has unpinned the GaAs Fermi level for the first time. Systematic heat treatments under various gases and temperatures were studied to achieve low leakage currents of 10~(-8) - 10~(-9) A/cm~2 and low D_(it)'s in the range of 4-9 x 10~(10) cm~(-2)V~(-1). By removing moisture from the oxide, thermodynamic stability of the Ga_2O_3(Gd_2O_3)/GaAs hetero-structures and the interfaces were achieved with high temperature annealing, which is needed for fabricating inversion-channel MOSFET's. More importantly, Ga_2O_3(Gd_2O_3) remains amorphous and the interface remains intact with atomic smoothness and sharpness. The mechanism of Fermi-level unpinning in atomic layer deposition (ALD)-Al_2O_3 ex-situ deposited on GaAs (InGaAs) was studied and unveiled. Single crystal Gd203 was found to grow epitaxially on GaAs and unpin its Fermi level, the first time for a single crystal oxide on semiconductor. We have also reviewed the work of inversion-channel, depletion-mode, and power GaAs MOSFET's using Ga_2O_3(Gd_2O_3) as the gate dielectric. The recent advances in HfO_2 gate oxides grown by MBE on Si and the device results of the MOSFET with metal gate of TiN and gate dielectric of HfO_2 were discussed. The work of GaN passivation is reviewed, which will play an important role in high temperature and high power electronic device application. Finally, recent work of high-quality nano-thick single crystal oxides of gamma-Al_2O_3 and Sc_2O_3 epitaxially grown on Si (111) is discussed.
机译:我们对GaAs(及其相关复合半导体),Si和GaN上的高κ门电介质上的一些研究活动。 Ga_2O_3(GD_2O_3),是从UHV中从镓 - 钆 - 石榴石靶蒸发的电子束的新型氧化物,首次取消了GaAs Fermi水平。研究了各种气体和温度下的系统热处理,以实现10〜(-8) - 10〜(-9)A / cm〜2和低D_(IT)的低漏电流,在4-9 x范围内10〜(10)cm〜(-2)v〜(-1)。通过从氧化物中除去水分,通过高温退火实现Ga_2O_3(GD_2O_3)/ GaAs杂结构和界面的热力学稳定性,这是制造反转通道MOSFET所需的高温退火。更重要的是,GA_2O_3(GD_2O_3)仍然是无定形的,界面保持完整,具有原子平滑度和清晰度。研究了在GaAs(InGaAs)上沉积在GaAs(InGaAs)上的原子层沉积(ALD)-Al_2O_3前原位的FERMI水平的机制。发现单晶GD203在GaAs上外延生长,并在半导体上首次进行单晶氧化物的第一时间来生长。我们还使用Ga_2O_3(GD_2O_3)作为栅极电介质介绍了反转通道,耗尽模式和电源GaAs MOSFET的工作。讨论了MBE在Si上生长的HFO_2栅极氧化物的最新进展和MOSFET的MOSFET的器件结果与HFO_2的锡和栅极电介质的金属栅极。综述了GaN钝化的工作,这将在高温和高功率电子设备应用中发挥重要作用。最后,外延生长在Si上的γ-Al_2O_3的和Sc_2O_3的高品质纳米厚的单晶氧化物的最近的工作(111)进行了讨论。

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