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HIGH PERFORMANCE METAL GATE CMOSFETS WITH AGGRESSIVELY SCALED HF-BASED HIGH-K

机译:高性能金属栅极CMOSFET,具有积极缩放的HF高k

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摘要

The optimization of MOSFET performance with Hf-based high-k and TiN metal gate is discussed. MOSFET performance and mobility of metal and poly gate on both high-k and SiO_2 are compared. Optimization of the thickness and composition of Hfsilicate is discussed in terms of charge trapping and boron diffusion. The effect of metal gate thickness is also investigated. Appropriate dry and wet etch processes are found to effectively eliminate the metal foot and high-k undercut. Impressive I_(on)-I_(off) characteristics have been achieved by applying an optimized gate-first CMOS flow to the high-k/metal stack. I_(on) = 1100μA/μm and 540μA/μm was attained for N and PMOSFETs with V_(dd)= 1.2V and I_(off) = 100nA/μm.
机译:讨论了基于HF的高k和锡金属栅极的MOSFET性能的优化。比较MOSFET性能和金属和多栅极在高k和SiO_2上的移动性和移动性。在电荷捕获和硼扩散方面讨论了HFSILICate的厚度和组成的优化。还研究了金属栅极厚度的效果。发现适当的干燥和湿蚀刻工艺有效地消除金属脚和高k底切。通过将优化的栅极 - 第一CMOS流应用于高k /金属堆叠来实现令人印象深刻的I_(ON)-i_(OFF)特性。对于具有V_(DD)= 1.2V和I_(OFF)= 100NA /μm的N和PMOSFET,达到了I_(ON)=1100μA/μm和540μA/μm。

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