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Effect of Reverse Bias Stress on Leakage Currents and Breakdown Voltages of Solid Tantalum Capacitors

机译:反向偏置应力对固体钽电容器泄漏电流和击穿电压的影响

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The majority of solid tantalum capacitors are produced by high-temperature sintering of a fine tantalum powder around a tantalum wire followed by electrolytic anodization that forms a thin amorphous Ta_2O_5 dielectric layer and pyrolisis of manganese nitrite on the oxide to create a conductive manganese dioxide electrode. A contact to tantalum wire is used as anode terminal and to the manganese layer as a cathode terminal of the device. This process results in formation of an asymmetric Ta - Ta_2O_5 - MnO_2 capacitor that has different characteristics at forward (positive bias applied to tantalum) and reverse (positive bias applied to manganese cathode) voltages. Reverse bias currents might be several orders of magnitude larger than forward leakage currents so I-V characteristics of tantalum capacitors resemble characteristics of semiconductor rectifiers. Asymmetric I-V characteristics of Ta - anodic Ta_2O_5 systems have been observed at different top electrode materials including metals, electrolytes, conductive polymers, and manganese oxide thus indicating that this phenomenon is likely related to the specifics of the Ta - Ta_2O_5 interface. There have been multiple attempts to explain rectifying characteristics of capacitors employing anodic tantalum pentoxide dielectrics: (1) Analysis of photoeffects and variations of capacitance with applied voltage allowed Sasaki [1] to conclude that the oxide film can be presented as a p-i-n junction. A thin n-type layer is formed at the Ta interface due to excess of Ta atoms, and a p-type layer is formed at the external oxide surface due to excess of oxygen atoms. (2) Vermileya [2] suggested that rectification in Ta - Ta_2O_5 systems occurs at flaws in the oxide layer by at least two mechanisms, one involving the opening of physical holes and the other an electronic junction that is formed by electrodes with different contact potentials resulting in an asymmetric barrier.
机译:大多数固体钽电容器通过钽导线周围的细钽粉末的高温烧结,然后在氧化物上形成薄的无定形Ta_2O_5介电层和锰亚硝酸盐的焦炭以产生导电锰二氧化碳电极。与钽丝的接触用作阳极端子和作为装置的阴极端子的锰层。该过程导致形成不对称的Ta-Ta_2O_5 - MnO_2电容器,其在向前(施加到钽的正偏压)并反向(施加到锰阴极的正偏压)电压的不同特性。反向偏置电流可能是比前向漏电流大的几个数量级,所以钽电容器的I-V特性类似于半导体整流器的特性。在不同顶部电极材料中观察到TA - 阳极TA_2O_5系统的不对称I-V特性,包括金属,电解质,导电聚合物和锰氧化物,因此表明这种现象可能与TA-TA_2O_5接口的细节有关。已经多次尝试解释采用阳极钽五氧化二氧化二氧化氧化物电介质的电容器的整流特性:(1)对照和施加电压的电容变化允许Sasaki [1]得出结论,氧化膜可以作为p-I-n结呈现。由于过量的TA原子,在TA接口处形成薄的n型层,并且由于过量的氧原子,在外氧化物表面处形成p型层。 (2)蠕虫[2]建议在氧化物层的缺陷中通过至少两个机构,涉及物理孔的开口的缺陷,另一个是由具有不同接触电位形成的电极形成的电子连接的泄露。导致不对称的屏障。

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