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Resistance and Inductance of Through-Wafer Vias: Measurement, Modeling, and Scaling

机译:通过晶圆通孔的电阻和电感:测量,建模和缩放

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摘要

The measurement of substrate vias (SMAs) in process control modules and the interpretation of that measurement is reviewed. They are seen to typically have resistances of about 5 mOhms and noisily variable inductances of 10 - 25 pHenry for a nominal 50 um diameter SVIA. Both increase for smaller SVIA diameters.
机译:综述了过程控制模块中基板通孔(SMA)的测量和该测量的解释。它们被认为通常具有约5μm的耐受约5μm的抗性,并且对于标称50μm直径的SVIA的10-25个苯的噪声的噪声电感。均增加较小的SVIA直径。

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