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Novel Approach for Visualizing Implants in Deep Submicron Microelectronic Devices Using Dopant Selective Etching and Low keV SEM

机译:使用掺杂剂选择性蚀刻和低kev SEM在深亚微米微电子器件中可视化植入物的新方法

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There is a significant need for direct dopant profile measurements in deep submicron microelectronic technologies. In this work, a novel approach for implant visualization is reported. The approach consists of two sequential steps: (1) selective chemical wet etch of doped regions with the new dopant selective etching (DSE) recipe, and (2) scanning electron microscopy imaging of the decorated regions under optimized low keV conditions. It was demonstrated that any combination of p/n type, dosage density or implant penetration depth can be visualized simultaneously using this method. The new DSE chemistry and low keV contrast mechanisms are described in detail.
机译:深度亚微电子技术中的直接掺杂剂型材测量有很大的需要。在这项工作中,报道了一种用于植入物可视化的新方法。该方法包括两个顺序步骤:(1)具有新的掺杂剂选择性蚀刻(DSE)配方的掺杂区域的选择性化学湿法蚀刻,(2)在优化的低KeV条件下扫描装饰区域的扫描电子显微镜成像。证明可以使用该方法同时可视化P / N型,剂量密度或植入渗透深度的任何组合。详细描述了新的DSE化学和低keV对比机制。

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