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On Gas-Phase Depletion During LPCVD of GeSi films using GeH_4/SiH_4 and GeH_4/Si_2H_6 Gas Sources

机译:使用GEH_4 / SIH_4和GEH_4 / SI_2H_6气体源在GESI薄膜LPCVD期间的气相耗尽

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In this work, a comparative study of Low Pressure Chemical Vapour Deposition (LPCVD) of Germanium-Silicon films has been carried out for two different precursor systems. Namely, mixtures of pure GeH_4 and SiH_4, of GeH_4 and Si_2H_6 were used. The experiments were performed using a long 60-cm wafer boat fully loaded with 3-inch wafers with a 0.5-cm spacing in between. For both systems, the distribution of deposition rate, germanium content and crystallinity of the films along the gas-flow direction in a batch-type reactor were compared. The effects of the gas-phase depletion on properties of the layers deposited at a temperature of 430 °C were studied.
机译:在这项工作中,对两种不同的前体系进行了锗 - 硅膜的低压化学气相沉积(LPCVD)的比较研究。即,使用Geh_4和Si_2H_6的纯GEH_4和SIH_4的混合物。使用长60cm晶片舟进行的实验,其与3英寸晶片完全装载,其中介于0.5cm间距。对于两个系统,比较了沿批量反应器中的气流方向沿气流方向的沉积速率,锗含量和结晶度的分布。研究了气相耗尽对沉积在430℃的温度下的层的性质。

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