DEPOSITION OF SILICON DIOXIDE FILMS AT TEMPERATURE AS LOW AS 100í• BY LPCVD USING ORGANODISILANE SOURCES

摘要

Process for depositing films of silicon dioxide by a low pressure CVD method, utilizing 1,4 disilabutane as the silicon precursor and molecular oxygen as the oxygen source. The deposition process permits films to be put down on a substrate at temperatures as low as 100 DEG C with essentially no carbon in the film. The 1,4 disilabutane can be used as a substitute for silane, a toxic, pyrophoric compressed gas.