THE LASER WRITING - DRY ETCH PROCESS FOR COST EFFICIENT 180 NM PHOTOMASK MANUFACTURING

摘要

The Chinese semiconductor industry has made huge progresses in last several years, The 180 nm technology is already a mature process in several advanced foundries. The low cost manufacturing has been always a focused topic for the success of the industry. A proven approach to reduce mask manufacturing costs is to replace e-beam writer with laser writer as the capability of the laser writing tool has been improved, In this paper we report our study on the comparison of a variety of mask making processes. The results show that implementing dry etch process is a more important factor in delivery of high quality masks for 180 nm photolithography and the laser writer is generally capable for the 180 nm pattern writing with good pattern fidelity. The costs and writing time are also discussed in the paper.