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Textures of Ferroelectric BLT Films for Semiconductor Memories by Electron Backscatter Diffraction and Piezo-response Force Microscope

机译:电子背散射衍射和压电响应力显微镜半导体存储器的铁电BLT膜的纹理

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Issues of ferroelectric high-density memories ( > 64Mb) indispensable for upcoming ubiquitous era have been on the cell integration less than 0.1um~2 and reliabilities. Thus nanoscale control of microstructures of ferroelectric films with large switching polarization has been one of the issues to obtain the uniform electrical properties for realization of high-density memories. In this study the grain orientations and distributions of BT-based films by spin-on coatings were examined by EBSD (electron backscatter diffraction) technique. Ferroelectric domain characteristics by PFM (piezo-response force microscope) were also performed to study the dependence of reliabilities on the grain orientations and distributions. It is believed that understandings of the nucleation and growth mechanisms of the a- or b-axis oriented films during the thermal processes such as RTA and furnace annealing affecting on grain orientation and uniformity could be possible based on this experimental results.
机译:铁电高密度存储器(> 64MB)的问题对于即将到来的普遍存在时代必不可少的是小于0.1um〜2和可靠性的细胞集成。因此,具有大开关偏振的铁电膜的微观结构的纳米级控制是获得高密度存储器的均匀电性能的问题之一。在该研究中,通过EBSD(电子背散射衍射)技术检查了通过旋涂涂层的BT基薄膜的晶粒取向和分布。还进行了PFM(压电响应力显微镜)的铁电域特征,以研究可靠性对晶粒取向和分布的依赖性。据信,基于该实验结果,可以可以理解在诸如RTA和炉子退火的热过程中,在热过程中,在诸如RTA和炉子退火的热过程中,可以基于该实验结果来实现影响晶粒取向和均匀性的均匀性。

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