Inspection of Multilayer Ceramic Structure Lamination Quality-Comparison of Nondestructive Methods

摘要

Lamination of green ceramic tapes is one of the most important technological steps in the fabrication of ceramic multi-layer hybrid electronics, sensors, actuators and microsystems. Therefore, optimization of the method is essential. The lamination quality of the structures in green or fired state can be investigated by several methods. The most common methods are: scanning acoustic microscopy (SAM), scanning electron microscopy (SEM), X-ray tomography. Application of the novel thermal method for inspection of the fired multilayer ceramic structures lamination quality is presented in the paper. Results obtained for the thermal method are compared to the results obtained for two different nondestructive techniques SAM and X-ray. Performed experiments have shown that thermal method can be success-fully applied for evaluation of the ceramic layers lamination quality. Results achieved by all techniques are very similar and comparable. The presented thermal method enables to localize delaminations, small voids and particles of different materials which have been entrapped during lamination.