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Experimental methodology of contact edge roughness on sub-100 nm pattern

机译:亚100nm模式下接触边缘粗糙度的实验方法

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摘要

The measurement of edge roughness has become a hot issue in the semiconductor industry. Major vendors offer a variety of features to measure the edge roughness in their CD-SEMs. However, most of the features are limited by the applicable pattern types. For the line and space patterns, features such as Line Edge Roughness (LER) and Line Width Roughness (LWR) are available in current CD-SEMs. The edge roughness is more critical in contact process. However the measurement of contact edge roughness (CER) or contact space roughness (CSR) is more complicated than that of LER or LWR. So far, no formal standard measurement algorithm or definition of contact roughness measurement exists. In this article, currently available features are investigated to assess their representability for CER or CSR. Some new ideas to quantify CER and CSR were also suggested with preliminary experimental results.
机译:边缘粗糙度的测量已成为半导体行业的一个热门问题。主要供应商提供各种功能,可在CD-SEM中测量边缘粗糙度。但是,大多数功能受适用模式类型的限制。对于线条和空间图案,电流CD-SEM中有线边缘粗糙度(LER)和线宽粗糙度(LWR)等功能。边缘粗糙度在接触过程中更为关键。然而,接触边缘粗糙度(CER)或接触空间粗糙度(CSR)的测量比LER或LWR更复杂。到目前为止,不存在正式的标准测量算法或接触粗糙度测量的定义。在本文中,调查目前可用的功能以评估它们的CER或CSR的可见度。还提出了一些对量化CER和CSR的新想法,并进行了初步实验结果。

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