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Chip Package Co-Design of a Heterogeneously Integrated 2.45GHz CMOS VCO using Embedded Passives in a Silicon Package

机译:芯片封装共同设计了一种异质地集成的2.45GHz CMOS VCO,使用嵌入式硅胶包装

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Phase Noise Performance of a Voltage Controlled Oscillator that determines spectral purity is dependent on the Quality Factor (Q) of the tank in LC Oscillators. On-chip inductors that are used to realize the LC tank have comparatively low quality factors and consume considerable die area. Here a Chip-Package Co-Design for a 2.45GHz VCO is described using a high Q (~30) inductor embedded in a silicon substrate. The heterogeneously integrated circuit has a phase noise of -110dBc/Hz at a 100kHz offset with power dissipation of 28mW from a 2.5V supply and has a tuning range of 6%. The resulting improvement in inductor coil quality factor, phase noise and area savings compared to a fully integrated VCO design is demonstrated.
机译:确定光谱纯度的电压控制振荡器的相位噪声性能取决于LC振荡器中罐的质量因子(Q)。用于实现LC罐的片上电感器具有相对低的质量因素并消耗相当大的模具区域。这里,使用嵌入在硅衬底中的高Q(〜30)电感器描述了用于2.45GHz VCO的芯片封装共设计。异构集成电路的相位噪声为-110dBc / hz,在100khz偏移中,功耗从2.5V电源供电28mW,调谐范围为6%。与完全集成的VCO设计相比,导致电感线圈质量因子,相位噪声和面积节省的改善。

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