transceivers; radiofrequency amplifiers; substrates; power amplifiers; surface mount technology; moulding; dielectric measurement; MOS capacitors; assembling; passive filters; lead bonding; organic compounds; embedded passives; organic substrate; RF module; assembly characterization; wireless applications; RF front-end transmit power amplifier; GSM mobile phone; GPRS mobile phone; multiple transmit-side power amplifier die; integrated interstage circuitries; output matching circuitries; couplers; power level detector; power level control; transmit switches; receive switches; surface mount passive components; Bluetooth RF front-end transceiver; RF transceiver die; matching components; filters; RF radio; short-range communications; cellular phones; PDAs; computer network applications; LTCC; low temperature co-fired ceramic; module cost reductions; size reductions; band pass filter; balun; matching network; decoupling caps; competitive size modules; array panels; panel form; module assembly; packaging material; design optimization; electrical performance maximization; transfer molding material; PA module performance; dielectric property characterization; transfer molding compounds; EM simulation; output matching circuits; selective glob top experiments; design compensation; molding effects minimization; molding compound dielectric property; dielectric property measurement; dielectric constant; loss tangent; die output matching; physical structures; transmission lines; MOS capacitors; wirebonds structure; bias feeding; daisy chain coupler; band frequency shifting; power-out drop; GaAs die; interstage matching passives; die design; module design; 10 GHz; 1850 to 1910 MHz;
机译:RFModule的有机基板中嵌入式无源元件的高频特性和热阻
机译:射频模块有机基板中嵌入式无源元件的高频特性和热阻
机译:用于射频模块的无源器件嵌入式基板
机译:用于RF模块的有机基材的嵌入式的流体和组装表征
机译:在多层有机基板上的紧凑型RF /微波无源组件和模块。
机译:c-Si衬底上的Al2O3 / a-SiCx叠层的表面钝化和光学特性
机译:多层有机衬底上嵌入式无源器件参数化的寄生感知射频设计
机译:嵌入式电阻器和有机和无机基板中的电容器