Embedded Passives in Organic Substrate for Bluetooth Transceiver Module

摘要

A Bluetooth RF transceiver module comprises the RF transceiver die, its external matching components, switches, filters, and other components to fulfill the complete RF radio function, which can be used for short-range communications in cellular phones, PDAs, and computer network applications. Typically Low Temperature Co-fired Ceramic (LTCC) substrate is used for this application, due to its capability to embed passives, which reduces the module size. In this paper, the authors focused on embedding passives in organic substrate, which is in general more cost effective. A band pass filter (BPF), balun, matching network inductor, and decoupling caps were embedded successfully in the organic substrate, which dramatically reduced module size and cost, and resulted in size competitive modules comparing to LTCC.