Large-Diameter Wafer Process of Array-MEMS with Electrical Interconnection through a Thin Glass Wafer

摘要

A large-diameter wafer process of array-MEMS with electrical interconnection through a thin glass wafer was developed in this work. A glass wafer which has high-density via-holes filled with metal was adhered to a handle wafer with an adhesive layer (Polyimide) which can stand up to a temperature of anodic bonding. The via-holes were previously fabricated by Deep-