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Unpolished glass wafer, thinning system and method for thinning semiconductor wafer using unpolished glass wafer
Unpolished glass wafer, thinning system and method for thinning semiconductor wafer using unpolished glass wafer
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机译:未抛光的玻璃晶片,减薄系统和使用未抛光的玻璃晶片来减薄半导体晶片的方法
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摘要
A non-polished glass wafer, a thinning system, and a method for using the non-polished glass wafer to thin a semiconductor wafer are described herein. In one embodiment, the glass wafer has a body (e.g., circular body) including a non-polished first surface and a non-polished second surface substantially parallel to each other. In addition, the circular body has a wafer quality index which is equal to a total thickness variation in micrometers plus one-tenth of a warp in micrometers that is less than 6.0.
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