- - NON-POLISHED GLASS WAFER THINNING SYSTEM AND METHOD FOR USING THE NON-POLISHED GLASS WAFER TO THIN A SEMICONDUCTOR WAFER

摘要

Non-abrasive glass wafers, thinning systems, and methods of using such non-abrasive glass wafers to thin semiconductor wafers are disclosed herein. In one embodiment, the glass wafer has a body (e.g., a circular body) comprising a non-abraded first surface and a non-abraded second surface that are substantially parallel to each other. Additionally, the circular body has a wafer quality index such as a change in the total thickness of the micrometer of less than 6.0 plus one-tenth of the deflection in micrometers.