Reliability Study Of A Flip-Chip-On-Silicon BGA (FSBGA) Package

摘要

As a variant on fine pitch flip-chip soldering, single chip Ball Grid Array packaging has become increasingly popular largely because, like flip-chip itself, leadless BGA packaging offers a solution to many of the assembly problems associated with ever increasing IC lead count. In this paper, a procedure has been implemented which integrates material testing and rate dependent modeling, structural topological consideration, process variations, and accelerated thermal cycling life prediction. This procedure is then applied to a novel Flip-chip-on-Silicon BGA (FSBGA) package.