Cost Comparison of Temporary Bond and Debond Methods For Thin Wafer Handling

摘要

Miniaturization and increased performance demands are driving the industry to explore 2.5D and 3D packaging. Although progress has been made in recent years, many barriers remain. One primary cost driver for 2.5D and 3D processes is the temporary bond and debond method used for thin wafer handling. Various solutions are appearing on the market, but there is not a single method taking the lead as the obvious best choice. Many factors must be considered when looking at the total cost of a thin wafer handling solution. In this paper, we will use cost modeling to carry out detailed cost and yield trade-offs for temporary bond and debond methods. Instead of concentrating on one proposed solution that is available on the market, we will analyze a range of solutions, focusing on variables such as tool cost, material cost, throughput, yield, and interposer cost. With this analysis, we will determine the most significant cost drivers within the temporary bond and debond process and propose process details for a reasonable solution.