Temporary bonding technology improves thin wafer handling

摘要

The processing of compound semiconductors often requires back-thinning of the processed wafers or backside lithography. The poor mechanical properties of the wafers may result in a high ratio of wafer breakage even during substrate handling between two process steps. Compound materials such as GaAs, InP, SiC and others are expensive as basic materials and their value increases dramatically during processing. One solution to master the handling problems is reversible wafer bonding.