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Effect of stress on the densification of a low-temperature cofired ceramic (LTCC) system under constrained sintering

机译:应力对受约束烧结下低温COFITED陶瓷(LTCC)系统致密化的影响

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The effect of stress on the densification behavior of a low-temperature cofired borosilicate glass (BSG) + alumina system during constrained sintering of a multilayer BSG + alumina/alumina laminate has been investigated. Poorer densification and larger porous bulk viscosity are observed for the BSG + alumina densified under pressure-less constrained sintering in comparison to free sintering. This is caused by the in-plane tensile stress and anisotropic development generated in the transverse directions of the laminate during constrained sintering. The applied uniaxial stress required in the thickness direction to densify BSG + alumina under constrained sintering at 700-800°C varies in the range of 50-400 kPa, in agreement with those calculated theoretically.
机译:研究了应力对多层BSG +氧化铝层压板的约束烧结期间低温COFITED硼硅酸盐玻璃(BSG)+氧化铝系统的致密化行为的影响。与游离烧结相比,在减压烧结下致密化的BSG +氧化铝,观察到较差的致密化和较大的多孔体粘度。这是由在受约束烧结期间层压板的横向产生的面内拉伸应力和各向异性发育引起的。在700-800℃下在约束烧结下致密化BSG +氧化铝的厚度方向所需的施加的单轴应力在50-400kPa的范围内,与理论上计算的那些相一致。

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