Development of Ultra-Thin Microelectronic Multi-chip Assemblies

摘要

Ultra-thin, flexible microcircuit assemblies using thinned die (down to 20μm in thickness) and multilayer, thin film substrates (up to 4 conductor layers (five dielectric layers) at an overall thickness of approximately 10μm) have been fabricated. Such circuits offer significant promise in many advanced packaging applications such as: biomedical implant and monitoring devices, wearing apparel electronics, conformal antennas and receiver/ transmitter systems, and appliques of all types.