首页>
外国专利>
MICROELECTRONIC COMPONENT ASSEMBLY, SYSTEM HAVING A MICROELECTRONIC COMPONENT ASSEMBLY, AND CORRESPONDING PRODUCTION METHOD FOR A MICROELECTRONIC COMPONENT ASSEMBLY
MICROELECTRONIC COMPONENT ASSEMBLY, SYSTEM HAVING A MICROELECTRONIC COMPONENT ASSEMBLY, AND CORRESPONDING PRODUCTION METHOD FOR A MICROELECTRONIC COMPONENT ASSEMBLY
展开▼
机译:微电子组件组件,具有微电子组件组件的系统以及微电子组件组件的相应生产方法
展开▼
页面导航
摘要
著录项
相似文献
摘要
The invention relates to a microelectronic component assembly (100) having a sensor chip (1) for recording thermographic images. The sensor chip (1) has a front side (VS), a back side (RS), and a lateral surface (SF), which connects the front side (VS) to the back side (RS). The microelectronic component assembly (100) also comprises at least one evaluating circuit (A1), wherein the at least one evaluating circuit (A1) is in contact with the sensor chip (1) at least in some regions on the back side (RS) and/or the lateral surface (SF) of the sensor chip (1), and a lens, wherein the lens (L1) is arranged on the front side (VS) of the sensor chip (1) and covers the sensor chip (1), wherein the lateral surface (SF) of the sensor chip (1) and/or a lateral surface (SA) of the evaluating circuit (A1) and a lateral surface (SL) of the lens (L1) have traces of mechanical removal at least in some regions.
展开▼