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STUDIES ON NEW STABILIZERS FOR Tin(II) IN ACID Sn PLATING BATH

机译:酸锡镀浴中锡(II)的新稳定剂研究

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Bright Tin-plating in SnSO4 and H2SO4 solution is extensively used, which has advantages of high current efficiency, high deposition velocity, no need of heating, better abilities of throwing power & cover power, and the bright layer of anti-corrosion & welding ability. However, this kind of electroplating solution is very instable, and easily becomes turbidity or causes light yellow deposit. So it is of very important value to study stabilizers for Tin(II) in acid Sn-plating bath. A better stabilizer, including vanadium compound etc, was harvested through the orthogonal design.
机译:广泛使用SNSO4和H2SO4溶液中的明亮镀锡,具有电流效率高,沉积速度高,不需要加热,抛光功率和盖电源的更好能力,以及抗腐蚀和焊接能力的明亮层。然而,这种电镀溶液非常稳定,并且容易变得浊度或导致浅黄色沉积物。因此,在酸性浴浴中研究锡(II)的稳定剂是非常重要的价值。通过正交设计收获更好的稳定剂,包括钒化合物等。

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