首页> 外文会议>International Workshop on the Physics of Semiconductor Devices >Characteristics of Al/SrBi{sub}2Ta{sub}2O{sub}9/HfO{sub}2/Si structure using HfO{sub}2 as buffer layer for ferroelectric-gate field effect transistors
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Characteristics of Al/SrBi{sub}2Ta{sub}2O{sub}9/HfO{sub}2/Si structure using HfO{sub}2 as buffer layer for ferroelectric-gate field effect transistors

机译:Al / Srbi {Sub} 2TA {Sub} 2TA {Sub} 9 / HFO {Sub} 2 / Si结构使用HFO {Sub} 2作为铁电栅场效应晶体管的缓冲层

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摘要

We have investigated the structural and electrical properties of metal-ferroelectric-insulator-semiconductor capacitors with 280-nm-thick SrBi{sub}2Ta{sub}2O{sub}9 (SBT) ferroelectric films grown on Si as well as on Si with buffer layer (HfO{sub}2). The SBT thin films and HfO{sub}2 buffer layer were fabricated using rf magnetron sputtering method. XRD patterns revealed the formation of well crystallized SBT perovskite thin film on the HfO{sub}2 buffer layer which is evident from sharp peaks in XRD spectra. The electrical properties of the metal-ferroelectric-insulator-semiconductor (MFIS) structure were characterized by varying thickness of the HfO{sub}2 layer. The width of memory window in the capacitance-voltage curves for the MFIS structure decreased with increasing thickness of HfO{sub}2 layer. Leakage current density decreased significantly after inserting HfO{sub}2 buffer layer. This shows that the proposed Al/SrBi{sub}2Ta{sub}2O{sub}9/HfO{sub}2/Si structure ideally suitable for high performance ferroelectric memories.
机译:我们已研究了金属 - 铁电体 - 绝缘体 - 半导体电容器的结构和电特性与280-nm厚的SrBi {子} 2TA {子} 2O {子} 9(SBT)在Si上生长以及在Si与强电介质膜缓冲层(HFO {子} 2)。该SBT薄膜和HFO {子} 2缓冲层用RF磁控溅射法制造。 X射线衍射图谱表明结晶良好SBT的形成钙钛矿,其从在XRD谱图尖锐的峰是明显的的HfO {子} 2缓冲层上的薄膜。通过改变的HfO {子} 2层的厚度的金属 - 铁电体 - 绝缘体 - 半导体(MFIS)结构的电性能进行了表征。存储器窗口的在用于MFIS结构的电容 - 电压曲线的宽度随着增加的HfO {子} 2层的厚度减小。漏电流密度的HfO插入{子} 2缓冲层之后显著降低。这表明,所提出的Al / {的SrBi子} 2TA {子} 2O {子} 9 / {的HfO子} 2 / Si结构非常适合于高性能的铁电存储器。

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