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Comparison of two different conditioning disk designs in reference to cost of ownership of tungsten CMP

机译:两种不同的调节盘设计参考钨CMP的所有权成本

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The process of pad conditioning is an important part in the sphere of CMP. A pad conditioner is often used to remove polishing debris, and hence preventing the pad surface from glazing. The proper conditioning can assure the pad surface like new so it can hold slurry evenly for effective polishing (1). With the skillful selection of conditioning tools, consistence of pad properties can be improved and Cost of Ownership (CoO) can be reduced significantly. In order to optimise the W CMP process with regard to CoO, two different conditioning disks have been tested to prove their effectivity. This paper presents a comparison of the process results by the two different conditioning disks. Tungsten removal rate, uniformity and process stability are provided as a function of polishing pad life. In addition, Scanning Electron Microscope (SEM) images are provided to show the impact of the different conditioning disks on the pad surface and the influence of the number of conditioning cycles on the aging of the conditioning disk and polishing pad.
机译:垫调节过程是CMP球体的重要组成部分。焊盘护发素通常用于去除抛光碎片,从而防止垫表面玻璃窗。正确的调节可以确保垫表面如新的,所以它可以保持浆料均匀地抛光(1)。利用熟练的调节工具选择,可以提高焊盘性能的一致性,并且可以显着降低所有权成本(COO)。为了优化对COO的W CMP工艺,已经测试了两种不同的调节盘以证明其有效性。本文提出了两个不同的调节磁盘的过程结果的比较。作为抛光垫寿命的函数提供钨去除率,均匀性和工艺稳定性。另外,提供扫描电子显微镜(SEM)图像以显示不同调节磁盘对垫表面上的影响以及调节盘和抛光垫老化的调节循环的数量的影响。

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