CMP APPARATUS WITH IMPROVED CONDITIONER FOR CONTROLLING UNIFORMLY SURFACE OF POLISHING PAD AND REDUCING WORKING-TIME AND COSTS FOR MAINTENANCE AND CONDITIONING METHOD THEREOF

摘要

PURPOSE: A CMP(Chemical Mechanical Polishing) apparatus and a conditioning method thereof are provided to control uniformly a surface of a polishing pad and to reduce working-time and costs for maintenance by using a ring-type conditioner. CONSTITUTION: A CMP apparatus includes a polishing pad(19), a conditioner, and a head part. The conditioner(23) contacts the polishing pad. The head part(11) is used for loading a wafer(W) opposite to the polishing pad. The conditioner encloses an edge of the wafer. The conditioner is parallel with the polishing pad. The conditioner is formed like a ring-type structure.