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High output power InGaN ultraviolet light-emitting diodes fabricated on patterned substrates using metalorganic vapor phase epitaxy

机译:高输出功率IngaN紫外线发光二极管,采用金属蒸汽相外延上的图案底物上制造

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Ultraviolet (UV) light-emitting diodes (LEDs) with an InGaN multi-quantum-well (MQW) structure were fabricated on a patterned sapphire substrate (P88) using a single growth process of metalorganic vapor phase epitaxy. The GaN layer grown by lateral epitaxy on a patterned substrate (LEPS) has a dislocation density of 1.5×10{sup}8 cm{sup}(-2). The LEPS-UV-LED chips were mounted on the Si bases in a flip-chip bonding arrangement. When the UV-LED was operated at a forward-biased current of 20 mA at room temperature, the emission wavelength, the output power and the external quantum efficiency were estimated to be 382 nm, 15.6 mW and 24%, respectively. With increasing forward-biased current, the output power increased linearly and was estimated to be approximately 38 mW at 50 mA.
机译:使用金刚磷谱基底(P88)在图案化的蓝宝石衬底(P88)上制造具有InGaN多量子阱(MQW)结构的紫外(UV)发光二极管(LED)。在图案化衬底(LEP)上的横向外延生长的GaN层的位错密度为1.5×10 {sup} 8cm {sup}( - 2)。 LEPS-UV-LED芯片以倒装芯片键合装置安装在Si底座上。当UV-LED在室温下在20mA的正向偏置电流下操作时,发射波长,输出功率和外部量子效率估计为382nm,15.6 mw和24%。随着前向偏置电流的增加,输出功率线性增加,估计为约38mW,50 mA。

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