Hybrid Microassembly System for Three-Dimensional MEMS Components

摘要

This paper proposes the hybrid microassembly approach for three-dimensional MEMS components. The approach combines teleoperated microassembly with vision based microassembly. Thus, the three-dimensional microassembly can benefit from the both sides; dexterity of human motion by teleoperation, and high precision and automatic motion planning by vision-based micromanipulation. We demonstrate the feasibility of the proposed approach by handling 3D MEMS components and peg-inhole task.