Interconnect structures for high-speed long-distance signal transmission

摘要

This paper studies interconnect structures for long-distance signal transmission that exploits transmission line effects. We take up two basic structures, micro-strip and coplanar lines, and examine attenuation property and inductive coupling noise. We experimentally reveal that the relationship between interconnect length and required interconnect resource in 35nm and 130nm technologies. We can see that the interconnect size required for 10mm signal transmission is somewhat larger than that of the current top-metal interconnects.