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Complementary substrate-triggered SCR devices for on-chip ESD protection circuits

机译:用于片上ESD保护电路的互补基板触发的SCR设备

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The turn-on mechanism of SCR device is essentially a current triggering event. While a current is applied to the base or substrate of a SCR device, it can be quickly triggered on into its latching state. In this paper, the complementary substrate-triggered SCR devices, which are combined with the substrate-triggered technique and SCR devices, are first reported in the literature for using in the on-chip ESD protection circuits. A complementary style on the substrate-triggered SCR devices is designed to discharge both of the positive and negative ESD stresses on the pad. The total holding voltage of the substrate-triggered SCR device can be increased by adding the stacked diode string to avoid the transient-induced latchup issue in the ESD protection circuits. The on-chip ESD protection circuits designed with the proposed complementary substrate-triggered SCR devices for the I/O pad and power pad have been successfully verified in a O.25-μm STI CMOS process with the HBM (MM) ESD level of >8kV (650V) in a small layout area.
机译:导通SCR装置的机制基本上是一个电流触发事件。同时将电流施加到基座或一个SCR装置的基板时,可以快速地触发到其栓锁状态。在本文中,所述互补衬底触发SCR装置,其被结合衬底触发技术和SCR设备中,首先在文献中报道了使用在芯片上ESD保护电路。在衬底触发SCR设备A互补的样式被设计衬垫上的正的和负的ESD应力的放电两者。所述衬底触发SCR装置的总保持电压可以通过增加堆叠的二极管串,以避免在ESD保护电路的瞬态诱发闭锁问题增加。设计与所提出的互补衬底触发SCR器件的I / O焊盘和电源焊垫片上ESD保护电路已经被成功地验证在O.25微米STI CMOS工艺与HBM的(MM)ESD水平> 8kV的(650V)在小布局面积。

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