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Complementary substrate-triggered SCR devices for on-chip ESD protection circuits

机译:用于片上ESD保护电路的互补衬底触发SCR器件

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The turn-on mechanism of the SCR device is essentially a current triggering event. When a current is applied to the base or substrate of a SCR device, it can be quickly triggered into its latching state. In this paper, the complementary substrate-triggered SCR devices, which are a combination of the substrate-triggering technique and SCR devices, are first reported in the literature for use in on-chip ESD protection circuits. The complementary style of the substrate-triggered SCR devices is designed to discharge both positive and negative ESD stresses on the pad. The total holding voltage of the substrate-triggered SCR device can be increased by adding the stacked diode string to avoid the transient-induced latchup issue in the ESD protection circuits. The on-chip ESD protection circuits designed with the proposed complementary substrate-triggered SCR devices for the I/O pad and power pad have been successfully verified in a 0.25-/spl mu/m STI CMOS process with the HBM (MM) ESD level of <8 kV (650 V) in a small layout area.
机译:SCR设备的开启机制本质上是电流触发事件。当将电流施加到SCR设备的底部或基板时,它可以迅速触发进入其闩锁状态。在本文中,互补的衬底触发SCR器件是衬底触发技术和SCR器件的组合,首次在文献中被报道用于片上ESD保护电路。衬底触发的SCR器件的互补形式设计为可释放焊盘上的正ESD应力和负ESD应力。可以通过添加堆叠的二极管串来增加衬底触发的SCR器件的总保持电压,以避免ESD保护电路中的瞬变引起的闩锁问题。使用建议的用于I / O焊盘和电源焊盘的互补衬底触发SCR器件设计的片上ESD保护电路已通过HBM(MM)ESD级别的0.25- / spl mu / m STI CMOS工艺成功验证在较小的布局区域内的电压小于8 kV(650 V)。

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