Wafer Fab operates in complicated environment. Each Fab manufactures thousands Wafers per month with hundreds of specific Process steps by thousands people. The Potential Risk: Each human error and each equipment or system malfunction cause line yield loss. The common understanding follows the following assumptions: · Future economic technology is based on 0.13 micron & 300-mm silicon size. · All IC manufactures expect that wafer size increase will result in a reduction in cost/cm{sup}2 of silicon. · Excellent FABs achieve 94% Factory Line Yield. Achieving Factory Line Yield greater than 94% by structural computerized process is a real challenge.
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机译：晶圆厂在复杂的环境中运行。每个FAB每月制造数千次晶圆，数百名特定的工艺逐渐增加。潜在风险：每个人为错误和每个设备或系统故障都会导致线屈服损失。共同的理解遵循以下假设：·未来的经济技术基于0.13微米和300毫米的硅尺寸。 ·所有IC制造期望晶片尺寸的增加将导致硅的成本/ cm {sup} 2的降低。 ·优良的Fabs达到94％的工厂线屈服。通过结构计算机化过程实现出厂线产量大于94％是一个真正的挑战。
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