Pulse Plating Theory from a Users Perspective

摘要

The theory behind pulse plating and pulse reverse plating is reviewed and applied to general problems encountered in the plating shop. When to use and when not to use pulse and pulse reverse plating is explained. The theory is applied to the following practical problems: · Using the double layer to improve plating distribution on seed layers. · Using pulse parameters to control grain size and tensile strength. · Using pulse reverse plating to improve the thickness distribution.