首页> 外文会议>International Conference on Reliability, Maintainability and Safety >Discussion on Failure Mechanism and Modeling of Electrochemical Migration of High Density Printed Circuit Boards in Dust Environment
【24h】

Discussion on Failure Mechanism and Modeling of Electrochemical Migration of High Density Printed Circuit Boards in Dust Environment

机译:浅谈灰尘环境中高密度印刷电路板电化学迁移的故障机理及建模

获取原文
获取外文期刊封面目录资料

摘要

With the continuous development of science and technology, the use of printed circuit board (PCB) with high density is becoming more and more widespread. The reduction of the spacing between adjacent wires makes the PCB more prone to electrochemical migration (ECM), which eventually leads to the insulation failure. When the airborne dust deposits on PCB under severely polluted environment, the critical humidity, the ion concentration and the local temperature on PCB surface will be changed, which can increase the complexity of the ECM failure and degrade the reliability of the system. In this paper, the previous research about the failure mechanism and influencing factors of ECM are summarized. The time to failure (TTF) models of ECM are also discussed and compared. The potential impacts of dust contamination on the failure mechanism of ECM and life models of ECM of PCB are analyzed and proposed as a question for further investigation.
机译:随着科学技术的不断发展,使用具有高密度的印刷电路板(PCB)越来越普遍。相邻导线之间的间距的减小使得PCB更容易发生电化学迁移(ECM),最终导致绝缘故障。当在污染的环境下的PCB上的空气传播的粉尘沉积时,将改变临界湿度,离子浓度,离子浓度和PCB表面上的局部温度,这可以提高ECM故障的复杂性,并降低系统的可靠性。本文总结了对ECM的失效机制和影响因素的先前研究。还讨论并比较了ECM的失败时间(TTF)模型。分析了粉尘污染对PCB ECM和生命模型的失效机制的潜在影响,并提出了进一步调查的问题。

著录项

相似文献

  • 外文文献
  • 中文文献
  • 专利
获取原文

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号