Diagnostic and prediction of pad life in CMP

摘要

In this study, the pad surface topography in CMP process is investigated. A decomposition method is used to decompose the raw measurement into profile and roughness so that the individual role of profile and profile in CMP can be studied. It is shown that a collection of parameters can be used to identify the status of a pad surface profile obtained this way, while a raw measurement is always corrupted by the holey surface. Important parameters includes BAC (Bearing Area Curve) curves and some roughness parameters such as Ra, Rq, #DELTA# a and Ir etc.