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Hydrogenation of amorphous silicon thin film transistors

机译:非晶硅薄膜晶体管的氢化

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Two subjects on the plamsa hydrogenation of a-Si:H thin film transistor (TFT) have been discussed. Chemical evidence of the formation of dangling bonds on the hydrogen exposed silicon nitride surface has been obtained. The result can explain the TFT deterioration process. Repairing of the reactive ion etch damaged inverted, tri-layer a-SI:H TFT using palsma hydrogen has been studied. A new type of damage, i.e., positive charge trapping caused negative threshold voltage shift, has been observed which can be repaired with thermal annealing. Therefore, the influence of plasma hydrogen to TFT is process-and structure-dependent.
机译:已经讨论了A-Si:H薄膜晶体管(TFT)的Plamsa氢化的两个受试者。已经获得了在氢气暴露的氮化硅表面上形成悬空键的化学证据。结果可以解释TFT劣化过程。研究了使用PALSMA氢气的反应离子蚀刻损坏倒置的倒置,三层A-Si:H TFT。已经观察到新类型的损坏,即产生负阈值电压偏移,这可以通过热退火修复。因此,血浆氢对TFT的影响是工艺和结构依赖性的。

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