Optimization of Thermal Behavior for resistors in Ltcc and Possibilities to Increase the Performance

摘要

Low Temperature cofired Ceamics (LTCC) offers a wide range of opportunities to the designer by its almost unlimited number of layers. The compatibility to thick-film and the manufacturing process permit integrating printed resistors also in LTCC-modules. Resistors inside the multi-layer structures were fired together with the glass-ceramic body. They undergo additional firings with each postfire step. Cofired resistor pastes require a shrinkage match to the tape due to firing and must be chemically compatible to the surrounding tape material. The glass in the resistors tends to interact with the tape glass, which leads to a shift in ratio glass to resistive particles, resulting in a shift of resistor characteristics. But the main advantage of buried resistors is the increase in integration density