首页> 外文期刊>Circuit World >Analysis of steady-state and transient thermal properties of cermet, polymer and LTCC thick-film resistors
【24h】

Analysis of steady-state and transient thermal properties of cermet, polymer and LTCC thick-film resistors

机译:金属陶瓷,聚合物和LTCC厚膜电阻器的稳态和瞬态热性能分析

获取原文
获取原文并翻译 | 示例
           

摘要

Purpose - The purpose of this paper is to present the results of thermal analysis of cermet resistors made on alumina or LTCC substrate and polymer thick-film resistors embedded in FR-4 substrate. Design/methodology/approach - The study was performed using a thermal imaging method. The research was carried out with an additional consideration of such factors as sheet resistance (which depended on the type of resistive paste), the size and topology of element and the kind of contact material (Cu, Ag or Ni/Au). A few key points on the element were specified for which a more thorough analysis was carried out. The results were approximated by physically acceptable function which allowed to determine the influence of different mechanisms of heat transfer and determine their time and thermal constants. Findings - The effectiveness of heat dissipation from resistor is determined by the type of substrate material, width of conductive paths, and contact material. The best results were observed for elements with wider conductive paths made of Cu or Ni/Au. The LTCC substrate ensures the fastest achieving of stable temperature on the component. The changes of the temperature gradient in time can be described by a formula consisting of two or three exponent parts, each one presenting different mechanism of change. Research limitations/implications - These studies do not include more detailed determination of nature of found mechanisms of change. There has not also been established what form of the formula is more accurate physically description of the results for respective structure. Originality/value - The results provide important data of the thermal properties of the chosen materials. This allows to determine their usability for specific applications where heat distribution plays an important role. The used analysis method is proven to provide reliable results and can be considered to be used for further studies in that subject.
机译:目的-本文的目的是介绍对氧化铝或LTCC基板上制成的金属陶瓷电阻器和FR-4基板中嵌入的聚合物厚膜电阻器进行热分析的结果。设计/方法/方法-研究是使用热成像方法进行的。进行研究时还考虑了诸如薄层电阻(取决于电阻胶的类型),元素的尺寸和拓扑以及接触材料的种类(Cu,Ag或Ni / Au)等因素。在元素上指定了一些关键点,对其进行了更全面的分析。通过物理上可接受的函数对结果进行近似,该函数可以确定不同传热机制的影响,并确定其时间和热常数。发现-电阻器散热的有效性取决于基板材料的类型,导电路径的宽度和接触材料。对于由Cu或Ni / Au制成的具有较宽导电路径的元素,观察到了最佳结果。 LTCC基板可确保以最快的速度在组件上达到稳定的温度。温度梯度随时间的变化可以用由两个或三个指数部分组成的公式来描述,每个部分代表不同的变化机理。研究的局限性/含义-这些研究未包括对发现的变化机制的性质进行更详细的确定。还没有确定公式的哪种形式在物理上更准确地描述各个结构的结果。原创性/价值-结果提供了所选材料的热性能的重要数据。这样可以确定它们在热分布起重要作用的特定应用中的可用性。事实证明,所使用的分析方法可提供可靠的结果,可以认为已用于该主题的进一步研究。

著录项

  • 来源
    《Circuit World》 |2014年第1期|17-22|共6页
  • 作者单位

    Centre for Advanced Technology, Tele and Radio Research Institute, Warsaw, Poland;

    Faculty of Microsystem Electronics and Photonics, Wroclaw University of Technology, Wroclaw, Poland;

    Faculty of Microsystem Electronics and Photonics, Wroclaw University of Technology, Wroclaw, Poland;

    Faculty of Microsystem Electronics and Photonics, Wroclaw University of Technology, Wroclaw, Poland;

    Faculty of Microsystem Electronics and Photonics, Wroclaw University of Technology, Wroclaw, Poland;

  • 收录信息 美国《科学引文索引》(SCI);美国《工程索引》(EI);
  • 原文格式 PDF
  • 正文语种 eng
  • 中图分类
  • 关键词

    Cermet resistors; FR-4; Heat dissipation; LTCC; Thermal time constant; Thick-film resistors;

    机译:金属陶瓷电阻器;FR-4;散热;LTCC;热时间常数;厚膜电阻;

相似文献

  • 外文文献
  • 中文文献
  • 专利
获取原文

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号