首页> 外国专利> THICK-FILM RESISTOR COMPOSITION FOR FORMING THERMAL TRANSFER TAPE, THERMAL TRANSFER TAPE WHERE IT IS PASTED TO BASE FILM, AND METHOD FOR MANUFACTURING THICK-FILM RESISTOR USING THE THERMAL TRANSFER TAPE

THICK-FILM RESISTOR COMPOSITION FOR FORMING THERMAL TRANSFER TAPE, THERMAL TRANSFER TAPE WHERE IT IS PASTED TO BASE FILM, AND METHOD FOR MANUFACTURING THICK-FILM RESISTOR USING THE THERMAL TRANSFER TAPE

机译:用于形成热传递带的厚膜电阻器组合物,粘贴在基膜上的热传递带以及使用热传递带制造厚膜电阻器的方法

摘要

PROBLEM TO BE SOLVED: To provide a technology, wherein a thick-film resistor of arbitrary resistance value and shape is obtained without trimming being required as such resistance value as decided according to the length, width, and thickness the resistor can be corrected and selected. ;SOLUTION: A thick-film resistor composition for forming a thermal transfer tape comprising an organic vehicle which comprises mixed inorganic powder of 54-76 wt.% comprising glass powder, whose conductive component is ruthenium oxide and/or ruthenium pyrochlore oxide powder with main component being Pbo, SiO2, and Al2O3, a resin binder of 14-23 wt.%, and organic solvent 10-23 wt.%, is coated on a base film of polyethylene terephthalate, then a contained organic solvent is dried and removed for manufacturing a thermal transfer tape for forming a thick-film resistor with a thick-film resistor layer of a specified thickness being stuck. For an obtained transfer tape, a base film part corresponding to a thick-film resistor shape selected with respect to an insulating substrate is heated to melt a part of a thick-film resistor layer, which is thermally transferred to the insulating substrate for sticking, and is sintered so as to form a thick-film resistor.;COPYRIGHT: (C)1999,JPO
机译:解决的问题:提供一种技术,其中获得任意电阻值和形状的厚膜电阻器,而无需修整,该电阻器根据长度,宽度和厚度确定,可以校正和选择该电阻器。 ;解决方案:用于形成热转印带的厚膜电阻器组合物,其包含有机载体,所述有机载体包含54-76wt。%的混合无机粉末,所述无机粉末包含玻璃粉末,其导电组分为氧化钌和/或烧碱四氧化钌粉末,其主要成分为成分为Pbo,SiO 2 和Al 2 O 3 ,14-23 wt。%的树脂粘合剂和10-将23wt。%的涂层涂覆在聚对苯二甲酸乙二醇酯的基膜上,然后干燥并除去所包含的有机溶剂,以制造用于形成热转印带的热转印带,该热转印带粘贴有规定厚度的厚膜电阻器层。 。对于所获得的转印带,将与相对于绝缘基板选择的厚膜电阻器形状相对应的基膜部分加热,以熔化厚膜电阻器层的一部分,该部分热转印至绝缘基板以进行粘贴,并被烧结以形成厚膜电阻器。;版权所有:(C)1999,日本特许厅

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