Influence of coeeficient ofThermal Expansion of Adhesive Resin in a Resin Pressure Contact Flip Chip

摘要

Epoxy resin adhesive is an extremely important element for ensuring the reliability of connection in the resin pressure contact flip-chip method. Up to now, it was considered sufficient, for the pressure contact flip-chip method, to use the same epoxy resin adhesive as in the solder-bonding flip-chip (FCA) method. In other words, the physical properties of such as epoxy resin adhesive had been examined in order to ease thermal stress generated by the difference in thermal expansion between the chip and the substrate. Accordingly, the coefficient of thermal expansion 9CTE) of the epoxy resin adhesive used in the solder-bonding FCA method is designed to be the same as that of the bump solder.