Improvement of the heat-dissipative structure of a flip chip module involves covering the module completely with an epoxy resin to provide direct contact between the module and resin

摘要

A heat-dissipative structure for a flip-chip module (1) comprises an epoxy resin (41) which completely surrounds the module (1). Direct contact is thus achieved between the epoxy resin (41) and the module (1) so that heat transfer is improved. The heat-dissipative structure of a flip-chip module (1) uses an epoxy resin (41) for completely surrounding the module (1). The module (1) is encased on the topside of a substrate (11) having solder balls (111) on its underside. Solder beads (211) between the chip (21) and the substrate (11) are completely surrounded by a filling material (31). The module (1) is covered with an epoxy resin (41) having conducting particles so that direct contact between the epoxy resin (41) and the module (1) is able to reduce the length of the heat transfer path, thus improving the efficiency of heat transfer. The substrate can be replaced by a lead frame.